Con il termine Package, si intende il contenitore in cui sono racchiuse alcune tipologie di componenti elettronici. Questi possono essere semplici rel่, circuiti costituiti da reti di resistori o transistor, oppure circuiti integrati compresi i microprocessori.
Il Package del microprocessore ่ costituito da materiale plastico, ceramico o vetronite, nel quale ่ montato il core, collegato elettricamente ai pin di contatto che andranno a innestarsi nel socket ("zoccolo").
DIP (Dual In-Line Package)
QFP (Quad Flat Package)
PLCC (Plastic Leaded Chip Carrier)
LCC (Leadless Chip Carrier)
PGA (Pin Grid Array)
TCP (Tape Carrier Package)
MMC (Mobile Module Connector)
MCC (Mini-Cartridge Connector)
LGA (Land Grid Array)
SECC (Single Edge Contact Cartridge)
SEPP (Single Edge Processor Package)
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DIP (Dual In-Line Package)
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Caratteristiche:
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| Tipo: |
DIP (Dual In-Line Package)
PDIP (Plastic Dual In-Line Package)
CDIP / CerDIP (Ceramic Dual In-Line Package) |
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| Modello: |
DIP 40
CDIP 40
PDIP 40
DIP 64 |
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| Note: |
Intel C8086 |
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QFP (Quad Flat Package)
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Caratteristiche:
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| Tipo: |
PQFP (Plastic Quad Flat Package)
CQFP (Ceramic Quad Flat Package)
TQFP (Thin Quad Flat Package) |
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| Modello: |
PQFP 100
CQFP 100
TQFP 304
TQFP 100 |
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| Note: |
Intel FC80486DX4-75 Mobile |
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PLCC (Plastic Leaded Chip Carrier)
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Caratteristiche:
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| Tipo: |
PLCC (Plastic Leaded Chip Carrier) |
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| Modello: |
PLCC 68 |
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| Note: |
AMD N80L286-10/S |
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LCC (Leadless Chip Carrier)
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Caratteristiche:
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| Tipo: |
LCC (Leadless Chip Carrier) |
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| Modello: |
LCC 68 |
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| Note: |
Intel R80286-10 |
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PGA (Pin Grid Array)
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Caratteristiche:
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| Tipo: |
PPGA (Plastic Pin Grid Array)
CPGA (Ceramic Pin Grid Array)
SPGA (Staggered Pin Grid Array)
OPGA (Organic Pin Grid Array)
MPGA (Metal Pin Grid Array)
FC-PGA (Flip Chip Pin Grid Array)
FC-PGA 2 (Flip Chip Pin Grid Array with Heat Spreader) |
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| Modello: |
PGA 68
PGA 125
PGA 132
PGA 168
PGA 296
PGA 321 |
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| Note: |
Intel A80386DX-25 |
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TCP (Tape Carrier Package)
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Caratteristiche:
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| Tipo: |
TCP (Tape Carrier Package) |
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| Modello: |
TCP-320 |
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| Note: |
Intel Pentium TT80502-75 |
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MMC (Mobile Module Connector)
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Caratteristiche:
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| Tipo: |
MMC (Mobile Module Connector) |
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| Modello: |
MMC-1 (Mobile Module Connector Type 1)
MMC-2 (Mobile Module Connector Type 2) |
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| Note: |
Intel Pentium II PMD26605001AB |
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MCC (Mini-Cartridge Connector)
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Caratteristiche:
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| Tipo: |
MCC (Mini-Cartridge Connector) |
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| Modello: |
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| Note: |
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LGA (Land Grid Array)
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Caratteristiche:
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| Tipo: |
LGA (Land Grid Array) |
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| Modello: |
LGA-771
LGA-775
LGA-787
LGA-1156
LGA-1207
LGA-1366 |
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| Note: |
Intel Celeron D 336 - JM80547RE072CN |
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BGA (Ball Grid Array)
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Caratteristiche:
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| Tipo: |
TBGA (Tape Ball Grid Array)
PTBGA (Plastic Tape Ball Grid Array)
MPBGA (Metal Plastic Ball Grid Array) |
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| Modello: |
BGA-304
MPBGA-352 |
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| Note: |
QED MIPS RM7000-266T |
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SECC (Single Edge Contact Cartridge)
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Caratteristiche:
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| Tipo: |
SECC (Single Edge Contact Cartridge) |
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| Modello: |
SECC-242 (Single Edge Contact Cartridge)
SECC2-242 (Single Edge Contact Cartridge, Type 2)
SECC-330 (Single Edge Contact Cartridge) |
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| Note: |
Intel Pentium II 400/512/100/2.0v |
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SEPP (Single Edge Processor Package)
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Caratteristiche:
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| Tipo: |
SEPP (Single Edge Processor Package) |
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| Modello: |
SEPP-242 (Single Edge Processor Package) |
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| Note: |
Intel Celeron BX80524R300128 |
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